Computer Memory, Customized MCP solutions using NAND and NOR Flash memory for mobile industry, Specialized in 3D memory stacking, BGA rework and repair; Digital Memory; Electronic Packages; Modules; Packaging Materials; Testers ...

IC testing packaging technology service, providing IC backend turnkey service probing, wafer grinding, assembly: PBGA, FC BGA, MCM BGA, TSOP, CSP burn In: dynamic burn in, test burn In testing: memory, logic, mixed signal, embedded IC, program con ...