Production Facility for Semiconductor and Microelectronics Industry. Services Include Wafer Dicing, Die Sorting, Die Bonding and Wirebonding; Ceramic Dicing Service; Dicing ...

Pelican Packaging is recognized as a leading providers of full service automated semiconductor packaging. We provide a one stop service for all your packaging needs. Our services include but are not limited to: Tape and Reel, Laser Marking, Wafer Dicing, Electrical Test, Bowl Feeders, Odd Shapes, Dicing Services ...

Femtosecond Laser, Ultrafast Laser, Micromachining, Fiber Laser, Laser, Lasers; Research & Development Service; Fiber lasers for material processing of transparent and hard materials, scribing, dicing, cutting, surface texturing tissue modification, spectroscopy and biomedical imaging; Fiber, Mode-Locked ...

Ceramics Grinding, Alumina Oxide Grinding, Ceramic Grinding, Grinding Ferrite, Ceramic Machining, Massachusetts; Honing service. Advanced ceramic machining & precision grinding services. Hard fired ceramics, ferrite, dicing & slicing ...

Integrated Circuits, Integrated Circuit Assembly, Wafer Dicing, Die Bonding, Wire Bonding, Open Cavity Packaging, Flip Chip Assembly, Chip on Board Assembly, Cob Assembly, Quick Turnaround Assembly, Semiconductor Packages, Prototype Assembly, Qfn Assembly, Epoxy Die Attach, Solder Die Attach, Eutectic Die Attach, Flip Chip Assembly Service, Ball Bonding, Wedge Bonding, Stud Bumping, Heavy Wire Bonding, Transfer Molding, Ink Marking; Assembly Services To the Semiconductor & Optoelectronic Industries, Specializing In Quick ...