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Fineplacer Lambda Sub Micron Accuracy Bonder for Photonics Device Packaging and Assembly; Sub Micron Accuracy Bonders for Photonics Packaging and Assembly Laser Bars, Vcsels, Photo Diodes, Mems, Sensors, Leds, Flip Chip, Copper Pillar, High Process Flexibility within one Platform Makes These Systems Ideal for R&D, Prototype Environments. Manual, Motorized and Automated Models Accommodate Thermo Compression, Thermo Sonic, Eutectic, Epoxy, Acf & Indium Bonding. We Collaborate with Customers, Optics Equipment, Photonics, Transistors and Diodes

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Packaging and Assembly Equipment; Backgrind, Slicing, Lapping, Polishing Equipment; Die Sorter, Pick & Place; Flip Chip Placement Systems; Flat Panel Display Equipment; Panel Alignment, Cell Assembly Equipment; Repair, Rework Equipment; Vision, ID, Bar Code Systems; Inspection & Measurement Products; Flat, Notch Finding System; Instruments, Bench Top Test; PV Equipment; Wafers; Integration and Automation; Process Equipment; Transfer Systems for Wafer, Reticles or FPD's; Mask Making Materials; Mask, Assembly Equipment ...

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Integrated Circuits, Integrated Circuit Assembly, Wafer Dicing, Die Bonding, Wire Bonding, Open Cavity Packaging, Flip Chip Assembly, Chip on Board Assembly, Cob Assembly, Quick Turnaround Assembly, Semiconductor Packages, Prototype Assembly, Qfn Assembly, Epoxy Die Attach, Solder Die Attach, Eutectic Die Attach, Flip Chip Assembly Service, Ball Bonding, Wedge Bonding, Stud Bumping, Heavy Wire Bonding, Transfer Molding, Ink Marking; Assembly Services To the Semiconductor & Optoelectronic Industries, Specializing In Quick ...

Packaging and Assembly Equipment; Die Bonding, Attach Equipment; Die Sorter, Pick & Place; Flip Chip Placement Systems; Dispensing Systems, Assembly Equipment ...