Precision Ultrasonic Machining, Microabrasive Jet Machining, and CNC Grinding of Advanced Materials Including Cvd Sic, Sapphire, Alumina, Silicon, Quartz, Glass, Ceramic Composites; Hard & Brittle Materials. Structured Wafers for Mems Applications Including Mems Pressure Sensors and Microfluidic Applications. Single and Double Side Polished Borosilicate Wafers. Prototype Thru Production. Advanced Metrology Capabilities. Iso 9001:2008, Sensor and Transducer ...