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Evest Corporation was founded in 1999 by a group of visionaries who aimed to provide a full range of Integration services & products in the asian microelectronic industry. We core engineering capabilities include mechanical design, software engineering, vision, Soldering Tools, Industrial Equipment ...

Diacool High Performance Heat Sinks with Customized Cte; Rhp Develops and Produces High Performance Cooling Devices Based on a Metal Diamond Core Exhibiting Up to 600W, Mk and Thermal Expansion of 8 10Ppm, K. There is No need for Submounts for Diacool in Laserdiode, Hb LED, Power Electonic and Microelectronic Systems, as well as for Gan Modules, we offer Know How and Expertise in Hot Pressing, Sintering, Injection Moulding and Machining of High Tech Materials as an R&D Service Provider for Powder, Optics Equipment, Photonics ...

6200 Crossover Automatic Die Attach System; MicroAssembly Technologies MAT provides economical high accuracy die attach and dispensing systems for assembling Semiconductor, Optoelectronic, Microelectronic Component and Aerospace components. MAT's 6400, our flagship platform, and the NEW 6200 Crossover, are extremely versatile Automatic Die Bonders, employing an intuitive Windows Interface. Both support an, Semiconductor Industry ...

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Multilayer Aluminum Nitride and Alumina Htcc Electronic Packages. Ceramic Injection Molding. Adtech Ceramics Produces Custom Multilayer Co Fire Microelectronic Ceramic and Metal Packages Utilizing Htcc and Aln. Hd Alumina is also available with 0. 12µM Surface for Thin Film Applications. Applications Include Medical, Aerospace, Optoelectronics and High Frequency. Capabilities Include Design Assistance and Microwave Modeling for High Frequency Performance to 30Ghz. Ceramic Injection Molded and Etched, Optics Equipment, Photonics ...

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Magnetic field imaging technology in failure analysis. Semiconductor Failure Analysis Tools Neocera brings to the semiconductor failure analysis community its Magma magnetic field imaging microscopes, which can localize all static defects caused by shorts, leakages & opens in microelectronic systems. Neocera's Magma systems can accommodate 300 nm wafers for die level interconnects, PC boards for final packaging ...

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