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6200 Crossover Automatic Die Attach System; MicroAssembly Technologies MAT provides economical high accuracy die attach and dispensing systems for assembling Semiconductor, Optoelectronic, Microelectronic Component and Aerospace components. MAT's 6400, our flagship platform, and the NEW 6200 Crossover, are extremely versatile Automatic Die Bonders, employing an intuitive Windows Interface. Both support an, Semiconductor Industry ...
Die attach, wedge, wire bond demos & more in; Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of die attach solutions, wire bonding equipment, optoelectronic packaging systems and contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to obtain precision wire and ball bonders and automated component placement systems. Palomar, Semiconductor Industry ...
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