Materials, Process; CMP, Grind, Lap, Polish, Abrasive materials; Disco; Disco Leads the Industry in Dicing, Grinding and Polishing; Technologies. Our Dicing Equipment is Comprised of Lasers; Singulation, Semi Automatic, Fully Automatic, Single And; Dual Spindle Saws. Materials we work with Include Silicon; Gaas, Low K, Ceramics, Glass and Others; Grinding Equipment Consists of Semi Automatic, And; Fully Automatic Grinders Capable of Ultra Thin Grinding; while Dry Polishers and Plasma Etchers Address, Grinding Machines ...

Abrasives, Final Polisher Round 7/5 Extra With Velcro, Round Final Polisher for Granite, Frankfurt Flexible Pads, Triangular Polishing Buff, Round Silicon Brushes, Frankfurt Final Marble Polisher Abrasive, Round Synthetics Abrasive (Cut), Granite Polisher, Round Polishing Buff, Magnesite Bond Frankfurt Abrasives, Frank Furt Abrasive Brush, Synthetic Bond Butterfly Abrasives, Frankfurt 4 Segments Abrasive, Butterfly Synthetics Abrasive, Butterfly Final Marble Polisher, Frankfurt Diamond Brushes ...