Plasmatreat is the World Market Leader in Atmospheric Plasma Jet Technology, a High Tech Process for the Environmentally Friendly and Highly Effective Cleaning, Activation and Nanocoating of Material Surfaces for Subsequent Processes such as Adhesive Bonding, Painting, Printing or Foaming. Openair Plasma Technology; other Technologies for Panel Production (Thin Film); Functional Nano Coating with Plasmaplus; Coating Material, Sputtering Targets; 02 Glass Processing and Finishing; 02.03 Edge, Glass Processing ...

Packaging & Assembly Equipment; Packaging & Assembly Materials; Machine Shop, Fabrication Service; Process Equipment; Measurement, Inspection Service; Thin Film, Dielectric Film Materials; Components, Parts; Plating, Electro Chemical Plating for Device Assembly; Deposition, Pvd, Sputtering, Evaporation Equipment; Plating, Electro Polishing, Coating, Surface Treatment, Optics Equipment, Photonics, Assembly Equipment ...

Coating, Plating Thickness Measurement; Laboratory Equipment; Testing Equipment; Horiba Scientific Offers Products for Solids Samples Analysis from C, S, O, N & H Elemental Analyzers to Gd Oes Spectrometers (Glow Discharge Oes) for Bulk & Surface Analysis. Gd Profiler2 Provides Fast, Simultaneous Analysis of all Elements, Including N, O, H & Cl Gases, for Thin and Thick Film Characterization and Process Studies. Its Rf Source can Operate in Pulse Mode for Fragile Samples, Making it Useful for, Semiconductor Industry, Product Testing ...

Equipment, Process; Solar Cell Substrates, Crystalline Silicon & C Si, Thin Film; PV Materials; Thin & Thick Film Substrates for Mems; Led; Deposition, Physical Vapor & Pvd, Sputtering, Evaporation Equipment; Ingots, Wafers; Oled Related Equipment & Materials, Panel & Module, Solar Cell ...

Packaging and Assembly Equipment; Dispensing Systems; Litho for WLP: Bumping, D Interconnect Aligners; Wafer Level Bonders; Flat Panel Display Equipment; Alignment Film Coating Equipment; Luminous Layer Patterning and Sealing Equipment; MEMS Equipment; Deep RIE etching, Dry Etching; Wafer Level Bonders; PV Equipment; Thin Film; Process Equipment; Bumping Systems; Cleaning, Washing Equipment for Assembly & Packaging; Coat, Develop, Resist Processing, Track Equipment; Deposition, (CVD, PVD, ALD, Semiconductor Components, Assembly Equipment ...