Continue to strive for leading the semiconductor production; Introduction of the original process `ROKKO puremium process` turned to the visitor troubled by knife edge or the cleanning factor on the back of a pattern (particle and contamination) while thinning processing of the wafer for power and sensors progressed, Back grind ojf 6 inch SiC and sapphire wafer, polish(CMP), proposal of washing technology, Semiconductor Industry ...

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