Majelac Technologies provides IC assembly services, including wafer dicing, die bonding and wire bonding. We offer QUICK TURNAROUND same day assembly service. Assembly Services to the Semiconductor & Optoelectronic Industries, Specializing in Quick Turn Assembly & Packaging, Package Capabilities Include, Ceramic, Plastic, Ball Grid Array ...

Packaging and Assembly Equipment; Wafer Mount, Taping Equipment; Space simulation, Vacuum chambers; Vision, ID, Bar Code Systems; Packaging and Assembly Materials; Adhesives, Epoxies, Die Attach Compounds, Under fill; Bonding, Interconnect: Wire, Ribbon, Tape, Capillaries, Tools; Package Substrates, Laminate, Film based; PV Materials; Consumables, Assembly Equipment ...

Tools; Wafer Mount, Taping Equipment; Coat, Develop, Resist Processing, Track Equipment; Support Products; Packaging & Assembly Equipment; Packaging & Assembly Materials; Process Equipment; Package Substrates, Laminate, Film Based, Assembly Equipment ...

Wafer Level Bonders; Packaging & Assembly Equipment; Package Handling, Conveying Equipment; Die Bonding, Attach Equipment, Assembly Equipment ...

Semiconductor Components Assembly Equipment Robotics Material Handling Packaging and Device Feeding Systems Die Sorter Pick Place Flip Chip Placement Package Conveying Wafer Level Bonders Mount Taping Inspection Measurement Products Microscopes Optical Pv Integration Automation Test Linear Parts Accessories Motors Fans Electric Rotary Spindles Sensors Sub Transfer Loading Lifting Devices Motion Control Servo ...

Packaging and Assembly Equipment; Ball Placement, Attach Systems; Device Handling, Feeding Systems; Die Bonding, Attach Equipment; Die Sorter, Pick & Place; Flip Chip Placement Systems; Dispensing Systems; Package Handling, Conveying Equipment; Solder Reflow, Soldering & Brazing Equipment; Wire Bonding Equipment; Inspection & Measurement Products; Die Inspection, Die Shear; Wire Bonding Inspection, Test; MEMS Equipment; Wafer Level Bonders; Process Equipment; Bumping Systems; Test Equipment; Handlers, Assembly Equipment ...

Packaging & Assembly Equipment; Process Equipment; Automation & Robotics; Package Handling, Conveying Equipment; Equip, Hardware, Product Design, Integration & Mfg; Transfer Systems for Wafer, Reticles or Fpd's; Test Equipment; Device Handling, Feeding Systems; PV Equipment; Wafer Handling, Assembly Equipment, Robotics Components ...

Integrated Circuits, Asic, Ic, Analog, Asic Design, Mixed Signal, Digital, Design, Layout, Test, Semiconductor, Cmos, Wafer, Die, Silicon, Integrated, Circuit, Application Specific, D/A, A/D, Prototype, Soic, Tssop, Package, Chip Scale, Chip, Amplifier, Comparator, Sensor, Telecom, Medical; Low Power Turnkey Asic Design Services Specializing in Analog Asic & Mixed Signal Asic Design & Production; Low power turnkey ASIC design services specializing in analog ASIC & mixed signal ASIC design & production ...

Bread Food Package Horizontal Pillow Type Packaging Machine, Dongguan Three Servo Pillow Type High Speed Automatic Packing Machine, Dongguan High Speed Wafer Biscuit Packaging Line, Dongguan High Speed Wafer Biscuit Large Packaging Line, Dongguan Automatic Mooncake Packaging Production Line, Dongguan Separate Automatic Packing Production Line, Production Equipment ...